The Tddi Market Broke Out, And Unicom Plans To Double The Capacity Of The 80nm Process.

Microgrid news, driven by iPhone X, smart phones are moving towards full screen development. This trend has also led to the explosion of demand for touch panel TDDI chips.

According to Taiwanese industry sources, Unicom plans to double its 80nm process capacity in the fourth quarter of 2018 to meet the growing demand for TDDI chips. The main growth point of the chip is in the full screen smart phone market.

Credit Suisse points out that TDDI chip penetration in smartphones is expected to reach 20% to 30% this year, and more smartphones will be introduced into full screen next year, with penetration even reaching 40%.

CINNO Research estimates that the actual shipment of TDDI chips will exceed 300 million this year, up 70% from 2017, and the market size of TDDI will reach 5.5 billion yuan by 2020, nearly double the 3 billion yuan in 2018.

IC design factories including Lianyong, Silicon Creation, Spectrum, Duntai, etc., especially Lianyong TDDI fermentation, promoted the second quarter profit.
According to foreign media analysis, Lianyong TDDI is expected to ship 350-40 million units in the third quarter, together with the contribution of SoC and large panel DDI products, single-quarter revenue has a chance to increase by 5%, a four-year high. In the future, with the promotion of full screen penetration, there is room for growth of ASP.

It is understood that many TDDI suppliers in Taiwan are using the 80nm process technology to produce TDDI chips. With the outbreak of TDDI market, the demand for TDDI chips from suppliers is bound to surge.

At present, the number of wafers manufactured by TDDI chips suppliers using the 80nm process will remain at about 2000 chips per month in the first half of 2008. The joint expansion plan will help suppliers increase the supply of TDDI chips in the fourth quarter. (proofreading /Aki)